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Semiconductor pioneer FMC raises €100 million to set new standards for memory chips

Semiconductor pioneer FMC raises €100 million to set new standards for memory chips

by Frend | nov 13, 2025 | Corporate News

GO BACK Semiconductor pioneer FMC raises €100 million to set new standards for memory chips Oversubscribed financing round consisting of €77 million in Series C equity capital, led by HV Capital and DTCF, and €23 million in public funding, marking one of the largest...
FMC and CEA‑Leti Join Forces to Advance FeRAM CACHE+ Memory for the AI Era

FMC and CEA‑Leti Join Forces to Advance FeRAM CACHE+ Memory for the AI Era

by Frend | aug 15, 2025 | Corporate News

GO BACK FMC and CEA‑Leti Join Forces to Advance FeRAM CACHE+ Memory for the AI Era The future of AI depends on memory innovation. That was the clear message from a recent conversation between Thomas Rueckes, CEO of FMC, and Jean‑René Lèquepeys, Deputy Director and CTO...
Breaking the Memory Wall. Building the backbone for next-generation computing.

Breaking the Memory Wall. Building the backbone for next-generation computing.

by Frend | aug 15, 2025 | Industry News

GO BACK Breaking the Memory Wall. Building the backbone for next-generation computing. The bottleneck slowing progress The future of computing is running into a stubborn constraint.Memory is fast but forgetful. Storage remembers, but it is too slow. This gap between...
IPCEI Microelectronics and Communication Technologies – Ferroelectric Memory

IPCEI Microelectronics and Communication Technologies – Ferroelectric Memory

by Frend | aug 15, 2025 | Industry News

GO BACK IPCEI Microelectronics and Communication Technologies – Ferroelectric Memory Microelectronics is an economic multiplier for almost all relevant economic sectors and has a decisive influence on how innovative and therefore economically successful Europe...
Hardware-based AI with 3-dimensional ferroelectric memories

Hardware-based AI with 3-dimensional ferroelectric memories

by Frend | aug 15, 2025 | Industry News

GO BACK Hardware-based AI with 3-dimensional ferroelectric memories Artificial intelligence (AI) is considered a cross-industry driver of innovation and growth, but powerful models lead to a sharp increase in energy and water consumption due to cooling in data...
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Recent Posts

  • Semiconductor pioneer FMC raises €100 million to set new standards for memory chips
  • FMC and CEA‑Leti Join Forces to Advance FeRAM CACHE+ Memory for the AI Era
  • Breaking the Memory Wall. Building the backbone for next-generation computing.
  • IPCEI Microelectronics and Communication Technologies – Ferroelectric Memory
  • Hardware-based AI with 3-dimensional ferroelectric memories

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