• FMC strengthens technical leadership to scale DRAM+ and 3D CACHE+ technologies
• Thorsten Kammler (SVP Technology & Manufacturing) and Alexander Narr (VP Quality & Reliability) join FMC
• Senior experts combine manufacturing, quality and reliability expertise to accelerate scaleup

Dresden, 4 May 2026 – FMC, a leading semiconductor and memory chip company, today announced two senior technical appointments as it accelerates the transition from breakthrough device innovation to manufacturable, system‑ready products. Thorsten Kammler joins FMC as Senior Vice President, Technology & Manufacturing, while Alexander Narr takes on the role of Vice President, Quality & Reliability. Both senior experts will play a central role in scaling FMC’s DRAM+ and 3D CACHE+ technologies from proprietary device IP to high‑yield, production‑ready solutions for advanced AI workloads.

With over three decades of experience across AMD, GlobalFoundries and Huawei, Dr. Thorsten Kammler brings deep expertise in device physics, process integration and production transfer. Holding a PhD in Materials Science, he has led complex CTO‑office initiatives and applied structured engineering methodologies to industrialise advanced semiconductor technologies. At FMC, he will be responsible for translating DRAM+ device innovations into robust, repeatable manufacturing flows with high yield and predictable performance.

Alexander Narr joins FMC from ESMC in Dresden, where he most recently built up the company’s manufacturing quality and reliability function as Senior Manager. Prior to that, he held a series of senior quality leadership roles at Infineon Technologies, driving cross‑site frontend quality initiatives, digitalization programs and zero‑defect strategies, as well as strategic customer quality projects across Europe and Asia. Earlier, he was responsible for reliability and customer‑facing quality functions at GLOBALFOUNDRIES in Dresden and at memory manufacturer Qimonda. In his new role, Narr will focus on establishing scalable quality and reliability structures to support technology qualification, production ramp‑up and long‑term product robustness.

Thomas Rückes, CEO of FMC, said: “Thorsten and Alexander bring the technical depth and handson experience we need to move from laboratory milestones to reproducible, highquality products at scale. Together, they will help close the gap between device innovation and manufacturable system solutions.”

“FMC is at a pivotal moment, and I’m looking forward to helping translate its device leadership into scalable manufacturing processes that can support products at global scale,” Dr. Thorsten Kammler added.

“Quality and reliability are essential for strong products, trusted partnerships and longterm success. I look forward to contributing to FMC’s next phase of growth and helping establish the foundations for sustainable scaleup,” Alexander Narr emphasized.

The appointments underscore FMC’s strategic focus on engineering depth as a driver of speed, robustness and system integration. By strengthening expertise across device physics, process integration and chip architecture, FMC aims to shorten development cycles and accelerate the path from innovation to scalable production.

About FMC

FMC is a leading semiconductor and memory chip company based in Dresden, founded in 2016 to develop revolutionary memory chip technology. Based on the thin-film material hafnium oxide, the company has created a new class of memory cells with its DRAM+ chip – more sustainable, faster, and cost-efficient. Thanks to its extremely low power consumption, the technology significantly reduces the energy demand of AI data centers, laying the foundation for their scale-up in Europe and worldwide. FMC is now a fabless company, meaning it designs, develops, and markets its own products while outsourcing production to contract manufacturers (chip foundries). FMC is backed by investors including HV Capital, the DeepTech & Climate Fund (DTCF), Vsquared Ventures, eCAPITAL, Bosch Ventures, Air Liquide Venture Capital, M Ventures (Merck), Verve Ventures, Korean memory chip company SK hynix, semiconductor equipment manufacturer TEL, and other international investors. The company is led by CEO Thomas Rückes. For more information, visit ferroelectric-memory.com

Media contact FMC
Torben Gosau, Kekst CNC
torben.gosau@kekstcnc.com
+49 (0) 160 969 435 17