• Lars Melzer (VP Digital Design), Jacklyn Wong-Peetz (Chief of Staff), and Jörg Winkler (Fellow, Design Engineering) join FMC’s leadership team s
• The new hires mark a decisive step in FMC’s transition from Deeptech R&D to commercial-scale deployment of DRAM+ and CACHE+

Dresden, 27 July 2026 – FMC, a leading semiconductor and memory chip company, today announced three senior additions to its leadership team as it advances DRAM+ and CACHE+ toward commercial-scale deployment. Lars Melzer joins as VP Digital Design, Jacklyn Wong-Peetz has been appointed Chief of Staff to CEO Thomas Rueckes, and Jörg Winkler has taken on the role of Fellow, Design Engineering. Together, they will strengthen FMC’s design, execution and operational capabilities as the company moves from proprietary device IP to system-ready products for advanced AI and datacenter workloads.

Lars Melzer joins as VP Digital Design to lead FMC’s digital design organization and drive the architecture and delivery of DRAM+ and CACHE+ product families for AI and datacenter workloads. He brings more than two decades of experience in integrated circuit and digital design leadership, most recently as Director Digital Design at NXP Semiconductors in Dresden. Melzer is also co-founder and former Managing Director of Commsolid, a specialist for LTE and NB-IoT modem IP, and previously led the hardware design of all generations of Intel’s LTE modem at Intel Mobile Communications.

Jacklyn Wong-Peetz has been appointed Chief of Staff to CEO Thomas Rueckes, driving operational alignment, milestone-based execution and leadership cadence as FMC scales toward commercial deployment. She brings more than 15 years of international semiconductor experience across front-end and back-end operations, financial controlling, organization scaling and large-scale site leadership. She joins FMC from GlobalFoundries in Dresden, where she most recently served as Director Global Fab Engineering Service Management and previously as Chief of Staff to the Fab1 Managing Director.

Jörg Winkler takes on the role of Fellow, Design Engineering, to shape FMC’s chip architecture and digital design strategy for DRAM+ and CACHE+. He brings more than three decades of experience in SoC architecture, advanced node tape-outs and system-level optimization from senior roles at GlobalFoundries, AMD and the Fraunhofer Institute. Winkler has worked extensively on power, performance and area optimization across technology nodes from 28 to 7 nanometers and holds twelve patents.

Thomas Rueckes, CEO of FMC, stated: “With Lars, Jacklyn and Jörg, we have added exactly the combination of expertise FMC needs at this stage: world-class design leadership, rigorous operational execution and deep experience in scaling complex digital design programs. I am delighted to welcome them to our team.”

Lars Melzer, VP Digital Design, closed: “Bringing DRAM+ and CACHE+ into robust, system-ready products is one of the most exciting design challenges in the industry today, and I look forward to shaping FMC’s digital design organization for exactly that mission.”

“FMC is at a defining moment, moving from breakthrough technology to commercial scale. I’m looking forward to helping the team turn that ambition into disciplined, milestone-based execution,” added Jacklyn Wong-Peetz, Chief of Staff.

Jörg Winkler, Fellow, Design Engineering, said: “CACHE+ opens up a new design space for memory in AI systems, and I’m excited to help realize its full potential through architecture and IP choices that truly shift system‑level efficiency.”

The appointments follow FMC’s recent leadership build-out, including Dr. Thorsten Kammler as SVP Technology & Manufacturing, Alexander Narr as VP Quality & Reliability, Dr. Reinhard Ploss as Advisory Board Chairman, Dr. Rutger Wijburg as Advisory Board Management Representative, and Senior Advisors Dr. Dick Thurston and Joe Rauschmayer. Together, they strengthen the leadership bench FMC needs to industrialize DRAM+ and CACHE+ for the next generation of AI infrastructure.

About FMC

FMC is a leading semiconductor and memory chip company based in Dresden, founded in 2016 to develop revolutionary memory chip technology. Based on the thin-film material hafnium oxide, the company has created a new class of memory cells with its DRAM+ chip – more sustainable, faster, and cost-efficient. Thanks to its extremely low power consumption, the technology significantly reduces the energy demand of AI data centers, laying the foundation for their scale-up in Europe and worldwide. FMC is now a fabless company, meaning it designs, develops, and markets its own products while outsourcing production to contract manufacturers (chip foundries). FMC is backed by investors including HV Capital, the DeepTech & Climate Fund (DTCF), Vsquared Ventures, eCAPITAL, Bosch Ventures, Air Liquide Venture Capital, M Ventures (Merck), Verve Ventures, Korean memory chip company SK hynix, semiconductor equipment manufacturer TEL, and other international investors. The company is led by CEO Thomas Rückes. For more information, visit ferroelectric-memory.com

Media contact FMC
Torben Gosau, Kekst CNC
torben.gosau@kekstcnc.com
+49 (0) 160 969 435 17