Chuck Dennison
Ex VP of Process Integration, Intel & Micron
Chuck Dennison is a veteran semiconductor process integration executive with over 40 years of experience scaling novel memory architectures into commercial production. Chuck is one of a select few engineering leaders with direct, senior-level experience across multiple distinct non-volatile and alternative memory technologies, having served as Vice President of Optane Memory Process Integration at Intel Corporation and Vice President of NAND Process Integration at Micron Technology.
Prior to his VP roles at Intel and Micron, Chuck spent over a decade as Vice President and Chief Operating Officer at Ovonyx, Inc., where he spearheaded the development and integration of Phase Change Memory as a next-generation non-volatile technology. His extensive industry tenure also includes managing Advanced DRAM and SRAM process integration teams at Micron, as well as early engineering roles at Hewlett-Packard and California Devices.
Chuck holds a Master of Science in Electrical Engineering from UC Berkeley and a Bachelor of Science in Electrical Engineering from the Massachusetts Institute of Technology.
Subscribe to our newsletter
Latest FMC news and technology insights, delivered monthly.
Backed by industry leaders & investors









Supported by







