by Frend | aug 15, 2025 | Industry News
GO BACK Breaking the Memory Wall. Building the backbone for next-generation computing. The bottleneck slowing progress The future of computing is running into a stubborn constraint.Memory is fast but forgetful. Storage remembers, but it is too slow. This gap between...
by Frend | aug 15, 2025 | Industry News
GO BACK IPCEI Microelectronics and Communication Technologies – Ferroelectric Memory Microelectronics is an economic multiplier for almost all relevant economic sectors and has a decisive influence on how innovative and therefore economically successful Europe...
by Frend | aug 15, 2025 | Industry News
GO BACK Hardware-based AI with 3-dimensional ferroelectric memories Artificial intelligence (AI) is considered a cross-industry driver of innovation and growth, but powerful models lead to a sharp increase in energy and water consumption due to cooling in data...
by Frend | aug 15, 2025 | Industry News
GO BACK The memory arms race. How FMC is ending the trade-off era. Every technological revolution has a single constraint that shapes its trajectory. Today, as AI systems, hyperscale data centers, and cloud networks scale at unprecedented speed, the defining...
by Frend | aug 17, 2025 | Industry News
GO BACK The Future of Memory and Storage (FMS) 2025 “Only a “Low Cost Adder” with >90% reuse from DRAM or NAND process can EVER ramp as a high volume technology. FE Capacitor DRAM is the ideal candidate due to tools and processes. FMC (FerroElectric Memory...
by Frend | aug 17, 2025 | Industry News
GO BACK For Leti and ST, the Fastest Way to Edge AI Is Through the Memory Wall In exclusive interviews with EE Times Europe, François Andrieu, head of advanced memory and computing at CEA-Leti, and Giuseppe Desoli, R&D director and company fellow at...
