What’s new at fmc
Breaking the Memory Wall. Building the backbone for next-generation computing.
GO BACK The bottleneck slowing progress The future of computing is running into a stubborn constraint.Memory is fast but forgetful. Storage remembers, but it is too slow. This gap between compute, memory, and storage, known as the Memory Wall, has been a challenge for...
IPCEI Microelectronics and Communication Technologies – Ferroelectric Memory
GO BACK Microelectronics is an economic multiplier for almost all relevant economic sectors and has a decisive influence on how innovative and therefore economically successful Europe is. For Germany as a business location, microelectronics is a central building block...
Hardware-based AI with 3-dimensional ferroelectric memories
GO BACK Artificial intelligence (AI) is considered a cross-industry driver of innovation and growth, but powerful models lead to a sharp increase in energy and water consumption due to cooling in data centers. The training of a single advanced AI model, for example...
The memory arms race. How FMC is ending the trade-off era.
GO BACK Every technological revolution has a single constraint that shapes its trajectory. Today, as AI systems, hyperscale data centers, and cloud networks scale at unprecedented speed, the defining constraint is no longer processing power. It is memory. For decades,...
The Future of Memory and Storage (FMS) 2025
GO BACK “Only a “Low Cost Adder” with >90% reuse from DRAM or NAND process can EVER ramp as a high volume technology. FE Capacitor DRAM is the ideal candidate due to tools and processes. FMC (FerroElectric Memory Corporation) Publicized FE based NV DRAM in 2025....
For Leti and ST, the Fastest Way to Edge AI Is Through the Memory Wall
GO BACK In exclusive interviews with EE Times Europe, François Andrieu, head of advanced memory and computing at CEA-Leti, and Giuseppe Desoli, R&D director and company fellow at STMicroelectronics, talked about how their organizations are exploring ways of...
Forget chasing trends—focus on what your application truly demands. It’s integration done right—reducing system complexity, cost, and power. In a world stuck on legacy standards, FMC chose a smarter path.
Hans Rohrer | Ex. President TSMC Europe
Behind the Breakthrough From Lab to Impact
An in-depth look into the people, science and insights behind FMC’s technology. For innovators and bold decision-makers.
Inside the Memory Shift
A thought leader series by FMC on the future of memory. Experts reveal how DRAM+ and CACHE+ technology is reshaping AI and infrastructure.
Fast, persistent, and ready to scale.
