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Semiconductor pioneer FMC raises €100 million to set new standards for memory chips

Semiconductor pioneer FMC raises €100 million to set new standards for memory chips

by Frend | nov 13, 2025 | Corporate News

GO BACK Semiconductor pioneer FMC raises €100 million to set new standards for memory chips Oversubscribed financing round consisting of €77 million in Series C equity capital, led by HV Capital and DTCF, and €23 million in public funding, marking one of the largest...
FMC and CEA‑Leti Join Forces to Advance FeRAM CACHE+ Memory for the AI Era

FMC and CEA‑Leti Join Forces to Advance FeRAM CACHE+ Memory for the AI Era

by Frend | aug 15, 2025 | Corporate News

GO BACK FMC and CEA‑Leti Join Forces to Advance FeRAM CACHE+ Memory for the AI Era The future of AI depends on memory innovation. That was the clear message from a recent conversation between Thomas Rueckes, CEO of FMC, and Jean‑René Lèquepeys, Deputy Director and CTO...
Neumonda and Ferroelectric Memory Collaborate in the Commercialization of Non-Volatile DRAM

Neumonda and Ferroelectric Memory Collaborate in the Commercialization of Non-Volatile DRAM

by Frend | jun 30, 2025 | Corporate News

GO BACK Neumonda and Ferroelectric Memory Collaborate in the Commercialization of Non-Volatile DRAM Neumonda and Ferroelectric Memory (FMC) are working together to design, provide test solutions, and market FMC’s nonvolatile DRAM+. This collaboration aims nothing less...
FMC Plans Memory Chip Factory in Saxony-Anhalt to Boost European Tech Sovereignty

FMC Plans Memory Chip Factory in Saxony-Anhalt to Boost European Tech Sovereignty

by Frend | aug 17, 2025 | Corporate News

GO BACK FMC Plans Memory Chip Factory in Saxony-Anhalt to Boost European Tech Sovereignty Dresden/Magdeburg, July 18, 2025 – FMC, a leading semiconductor and memory chip company, has announced plans to build a new memory chip factory in Sülzetal, located in the Börde...
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FMC brings in senior design and execution leaders for next phase of DRAM+ and CACHE+
FMC appoints senior technical leaders to accelerate commercial readiness for next‑generation memory
FMC adds Senior Advisors to support growth, manufacturing scale-up and global semiconductor ecosystem strategy
Breaking the Memory Wall. Building the backbone for next-generation computing.
IPCEI Microelectronics and Communication Technologies – Ferroelectric Memory
Hardware-based AI with 3-dimensional ferroelectric memories
Innovation Trifft Investition
Leti Innovation Days
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